Introducción
Disco is a Japanese-based manufacturer of semiconductor manufacturing equipment. Founded in 1937, the company primarily produces diamond saw blades, waterjet and laser dicing machines, as well as grinding and polishing machines. These machines are widely used in the back-end processes of semiconductor manufacturing—that is, thinning and dicing processed silicon wafers in the front-end processes to cut them into bare chips for packaging. Disco is the world's largest manufacturer of semiconductor-grade dicing and polishing machines, holding approximately 60% to 70% market share in the semiconductor dicing and polishing field as of 2025. The company has three main factories, all located in Hiroshima and Nagano prefectures, Japan.
